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Bondexpo

"Trade Fair for Industrial Bonding Technology"

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Date:	08-Oct-2012 to 11-Oct-2012
Industry:	Industrial & Engineering Products, Spares and Supplies
Event Place:	Stuttgart Neue Messe, Stuttgart, Germany
Organizer:	P. E. Schall Gmbh

Event Profile
Bondexpo is the most specialized international trade fair which will be focusing on industrial bonding technology. It will be an ideal location for introducing the latest joining technologies. There will be a showcase of raw materials for adhesives and sealants; machinery, equipment and accessories for the adhesives manufacturing industry; adhesives and sealants; machinery, equipment and accessories fort he adhesives processing industry; measuring and test technologies; fibrous composite materials and services. Bondexpo will provide comprehensive knowledge of industrial bonding technology and its usage & applications. Bonding means to connect different variety of materials with the diverse surface structures. In this event, all the queries of the exhibitors and visitors will be solved by providing practical solutions.

No of Exhibitors: 110++

Exhibit Profile

Cable Machinery	Machinery Repairs
Farm Machinery	Wire Machinery
Foam Machinery	Machinery Rebuilders
Film Machinery	Waste Machinery
Paper Machinery	Machinery Lubricants
Board Machinery	Road Machinery
Glass Machinery

Venue Details
Exhibition Center: Stuttgart Neue Messe
City: Stuttgart
Country: Germany

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No. of Exhibitors: 350+

Visitors: 10,000+

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Date: 09-Oct-2012 to 11-Oct-2012
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No. of Exhibitors: 900	Visitors: 18,000+
Area: 60,000 Square Meter

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